I-SMD, i-COB kunye ne-CSP ziintlobo ezintathu ze-strip ye-LED, i-SMD yeyona nto yemveli, ukuze kuhlangatyezwane neemfuno ezahlukeneyo zabathengi, ukusuka kumaso angama-5050 ukuya kwi-teknoloji ye-CSP yanamhlanje iya ihlaziywa, kwaye kukho zonke iintlobo zeemveliso kwimarike. , indlela yokukhetha phakathi kweemveliso?

Okwangoku, i-SMD kunye ne-COB zisetyenziswa ngokubanzi, nganye ineenzuzo zayo kunye nokungonakali kunye neemeko ezahlukeneyo zesicelo.I-SMD yeyona ixhaphakileyo, iindidi ngeendidi zobukhulu onokukhetha kuzo;I-COB ithandwa yimarike ngokulandelelana okuphezulu;kunye nokuzalwa komcwe omtsha wokukhanya we-CSP, ngenxa yetekhnoloji yokupakishwa kwetshiphu ephambili kwaye ikhokele ifashoni entsha yoshishino.Ke yintoni ukongamela komcu weCSP xa kuthelekiswa nomtya wemveli weCOB kunye ne-SMD strip?

Inkqubo yokupakisha ephambili ye-CSP

I-chip ye-LED, ekwabizwa ngokuba yi-chip ye-LED ekhupha ukukhanya, iyinxalenye engundoqo ye-LED strip ethambileyo, iya kuchaphazela ngokuthe ngqo umgangatho wokukhanya we-LED strip ethambileyo.Kwaye indlela yokwaphula ubunzima beteknoloji ye-chip yokupakisha, ngabavelisi abakhulu bazama ukunqumla imiqobo yobugcisa.

I-COB kunye ne-CSP esetyenziswa yiteknoloji yokupakisha yendabuko, isakhiwo sinzima, sichitha ixesha kunye nomsebenzi onzima, iindleko zokuvelisa ziphezulu.Ukukhanya kwe-LED egqityiweyo kuya kuncitshiswa ngenxa yokushisa kobushushu bezinto zokupakisha kunye nezinye izizathu zokuthintela, ukutshatyalaliswa kokushisa okungahambi kakuhle, kunye nokuzinza kwemveliso.

Emva kokulungiswa kwezobugcisa, i-chip ye-CSP ithatha "i-flip chip kunye ne-teknoloji yezinga le-chip", kunye nokumelana ne-thermal ephantsi kunye nokuzinza okuphezulu kombane.Ubungakanani bayo buba buncinci kwaye buncinci, kwaye ukusebenza kwayo kuzinzile.

Iindleko zokupakishwa kwe-CSP ziphantsi kakhulu kuneendleko zeteknoloji yokupakisha yendabuko, enokonga iindleko zabasebenzi kunye neendleko zokupakisha ngowona mlinganiselo mkhulu, kwaye ineendleko eziphezulu.

Umbala wokukhanya ochanekileyo kakhulu

I-COB yendabuko ithatha inkqubo ye-dot powder, umbala wokuxuba ukukhanya awuhlambulukanga, umbala awulula ukulawula xa udibanisa ukukhanya, kunye nokuhambelana kakuhle kombala kunokufezekiswa kuphela ngokuncama izinga lesivuno.

Izibane zesibane seCSP zicwangciswe ngokuxinene ngakumbi, ukukhanya kwahlulwe ngaphambi kokupakishwa, i-angle ekhanyayo inkulu, ukuchaneka kombala okhanyayo we-CSP kuphezulu, ekukhanyeni kombala wokuxuba ukukhanya, i-CSP xa ithelekiswa ne-COB yemveli, iingenelo nazo zicace ngakumbi. .

Ukuguquguquka okuphezulu

I-COB kunye ne-SMD ngokubanzi ziguquguqukayo, kwaye ukuba ayisebenzi kakuhle, i-COB iya kuphuma kwiphakheji, kwaye i-SMD inokwaphula umnini weentsimbi zesibane.

I-CSP, kwelinye icala, ikhuselekile kwaye ithembekile kuba akukho zikhonkco eziethe-ethe ezifana nezibiyeli kunye neengcingo zegolide, kwaye amaso ezibane akhuselwe ngokuncamathelisa idriphu.Umthamo wetshiphu uncinci, unokwenza ukukhanya ngakumbi kwaye ubhityile, i-angle yamandla egoba incinci, kunye nokuguquguquka okunamandla.

Iingcebiso ezintathu zemeko yesicelo semveliso

Ngokusekwe kumgangatho ofanelekileyo weemveliso ezi-3, ulwahlulo oluneenkcukacha ngakumbi lwemeko yokusetyenziswa lwenziwa.

Istrip ye-SMD isetyenziswa kakhulu ngenxa yobukhulu bayo obahlukeneyo obukhoyo, ifaneleke ngakumbi kulwandlalo lwangaphakathi, iimodeli ezingenamanzi nazo zinokusetyenziselwa ulwandlalo lwangaphandle.

I-COB strip enesiphumo esihle kakhulu somgca, isetyenziswe kwisibane sokuhombisa kunye neeprops ezibonisa ukukhanya kokukhanya kungcono.

Umcu weCSP unesiphumo esithile somgca kunye nokuguquguquka okungcono kunye nokugoba.Kwaye kwiphakheji ngaphambi kokwahlula ukukhanya, isivuno kunye nokuchaneka kombala okhanyayo kungcono kuneentlobo ezimbini zangaphambili ze-strip, ngokubhekiselele, eyona nto ibiza kakhulu.

Ke ngoko, ngokwembono ebanzi, ineenzuzo ezithile kwizicelo ezahlukeneyo zangaphakathi nangaphandle.Kwaye ubungakanani bayo compact, izicelo indawo emxinwa iinzuzo ezicacileyo ngakumbi.